Miniature low cost DDS single sideband upconverters-packaging options using Si and GaAs ICs

Author

Chu, A. ; Devine, J.F. ; Babbitt, H.S., III

Author_Institution

Mitre Corp., Bedford, MA, USA

fYear

1994

fDate

23-27 May 1994

Firstpage

1133

Abstract

A family of upconverters integrating a Direct Digital Synthesizer (DDS), a Single Side-Band Modulator (SSBM), and voltage controlled oscillator (VCO) was fabricated using different packaging technologies. Results indicate that the packaging option has direct impact on the speed of the digital circuit and on component interactions in the RF circuit. As the number of interfaces was reduced, the DDS output frequency increased from 200 to 560 MHz. Likewise, impedance matching on both IF and LO ports of the Ku-band subharmonic SSBM increased carrier and sideband suppressions over 10 dB to 32 and 43 dB, respectively. The paper discusses design trade-offs associated with the selection of the type of SSBM, available packaging options that influence performance, size, cost, and an approach to evaluate the effect of component interactions in the design of MCMs and MMICs.<>

Keywords

MMIC; frequency convertors; frequency synthesizers; gallium arsenide; multichip modules; silicon; surface mount technology; DDS single sideband upconverters; GaAs; GaAs ICs; Ku-band; MCMs; MMICs; RF circuit; SSB modulator; Si; Si ICs; VCO; design tradeoffs; digital circuit speed; direct digital synthesizer; impedance matching; miniature low cost convertor; packaging technologies; sideband suppressions; voltage controlled oscillator; Costs; Digital circuits; Digital modulation; Impedance matching; MMICs; Packaging; Radio frequency; Synthesizers; Voltage-controlled oscillators;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1994., IEEE MTT-S International

Conference_Location

San Diego, CA, USA

ISSN

0149-645X

Print_ISBN

0-7803-1778-5

Type

conf

DOI

10.1109/MWSYM.1994.335543

Filename

335543