Title :
A novel concept for MM-wave MMIC interconnects and packaging
Author :
Strauss, G. ; Menzel, W.
Author_Institution :
Microwave Techniques, Ulm Univ., Germany
Abstract :
Standard interconnect and packaging techniques for MMICs tend to get more and more difficult at MM-wave frequencies due to the increased influence of discontinuities and tolerances, especially in conjunction with temperature and hermetic sealing. To overcome these problems, a novel concept is proposed based on electromagnetic field coupling for interconnects and package feed-through elements. First theoretical and (scaled) experimental results are presented.<>
Keywords :
MMIC; integrated circuit technology; packaging; MIMIC; MM-wave MMIC interconnects; electromagnetic field coupling; package feed-through elements; packaging techniques; Electromagnetic coupling; Electromagnetic fields; Frequency; MMICs; Packaging; Temperature;
Conference_Titel :
Microwave Symposium Digest, 1994., IEEE MTT-S International
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-1778-5
DOI :
10.1109/MWSYM.1994.335545
