Flexible manufacturing of multichip modules for flip chip ICs

Author

Yee, Ian ; Miracky, Robert ; Reed, Jason ; Lunceford, Brent ; Wang, Minchuan ; Cobb, Deborah ; Caldwell, Guy

Author_Institution

Microelectron. & Comput. Technol. Corp., Austin, TX, USA

fYear

1997

fDate

4-5 Feb 1997

Firstpage

130

Lastpage

132

Abstract

A quick-turn flexible process for designing, verifying, and manufacturing multichip modules for use with flip chip ICs was developed. The process starts with MCC´s prefabricated customizable substrates. Laser based cut and link processes are used to program the necessary wires on the substrate. Laser direct write is also used to redistribute the flip chip area array bond pads to match the bond pads on the substrate. An efficient design to manufacturing process is assisted with the use of a software tool that allows the user to place and route the interconnections, and prepares the information needed for fabrication of the multichip modules

Keywords

flexible manufacturing systems; flip-chip devices; integrated circuit technology; laser beam machining; multichip modules; area array bond pads; design; flexible manufacturing; flip chip IC; interconnections; laser direct write; multichip module; prefabricated customizable substrate; software tool; verification; wire programming; Bonding; Flexible manufacturing systems; Flip chip; Laser beam cutting; Manufacturing processes; Multichip modules; Optical arrays; Process design; Software tools; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1997. MCMC '97., 1997 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-7789-9

Type

conf

DOI

10.1109/MCMC.1997.569357

Filename

569357