A low cost alternative to reinforcing PTFE based printed circuit boards

Manufacture of microstrip circuit boards on PTFE based laminates carries with it several inherent fabrication problems that require careful management. Warpage of the substrate due to stress release after etching and typically poor X-Y dimensional stability are two of the more important issues that need to be dealt with. Traditionally, metal backers have been incorporated in microstrips to solve these issues, although the addition of thick metal backers increases machining costs and complicates plating operations. New solutions to these fabrication problems have recently shown promise in dealing with complex circuit interconnect issues as well.<>