DocumentCode :
2198219
Title :
Heating mechanism and wave propagation in magnetically enhanced inductively coupled plasmas
Author :
Kinder, R.L. ; Kushner, M.J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
fYear :
2000
fDate :
4-7 June 2000
Firstpage :
85
Abstract :
Summary form only given. Magnetically Enhanced Inductively Coupled Plasmas (ME-ICPs) are being developed for microelectronics fabrication due to their high ionization efficiency and their ability to deposit power within the volume of the plasma. The power coupling of the antenna radiation to the plasma is of concern due to issues related to process uniformity. Several theories regarding modes of power deposition have been suggested. Landau damping has been proposed as a mechanism through which more efficient heating occurs. Electrons can be trapped in rapidly growing waves and accelerated to their phase velocity. More recently, it has been suggested that substantial electron heating is obtained from the electrostatic component of a helicon-like wave. To investigate these issues, we have improved the ElectroMagnetics Module (EMM) of the Hybrid Plasma Equipment Model (HPEM) to resolve the electric field propagation in ME-ICPs sustained in divergent magnetic fields. A full tensor conductivity and electrostatic source terms are directly included in the EMM. Plasma densities and power deposition are discussed for process relevant gas mixtures (e.g., Ar/Cl/sub 2/, Ar/CF/sub 4/) as a function of magnetic field strength and configuration.
Keywords :
antennas in plasma; plasma electromagnetic wave propagation; plasma heating; plasma transport processes; Ar-Cl/sub 2/; Ar-Cl/sub 2/ mixture; Ar-tetrafluoromethane mixture; antenna radiation; divergent magnetic fields; electric field propagation; electromagnetics module; electron acceleration; electron heating; electron phase velocity; electron trapping; electrostatic component; electrostatic source terms; heating mechanism; helicon-like wave; hybrid plasma equipment model; ionization efficiency; magnetic field configuration; magnetic field strength; magnetically enhanced inductively coupled plasmas; microelectronics fabrication; power coupling; power deposition; process relevant gas mixtures; process uniformity; rapidly growing waves; tensor conductivity; wave propagation; Argon; Couplings; Electrons; Electrostatics; Heating; Magnetic fields; Microelectronics; Plasma accelerators; Plasma density; Plasma waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 2000. ICOPS 2000. IEEE Conference Record - Abstracts. The 27th IEEE International Conference on
Conference_Location :
New Orleans, LA, USA
ISSN :
0730-9244
Print_ISBN :
0-7803-5982-8
Type :
conf
DOI :
10.1109/PLASMA.2000.854548
Filename :
854548
Link To Document :
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