Title :
Processing of Bi90Sb10 by Equal Channel Angle Extrusion
Author :
Im, J.-T. ; Hartwig, K.T. ; Sharp, J.
Author_Institution :
Dept. Mech. Eng., Texas A&M Univ., College Station, TX
Abstract :
Cast billets of Bi90Sb10 have been processed by equal channel angle extrusion (ECAE) in an effort to make the alloy in a highly textured, polycrystalline form for use as a low-temperature n-type thermoelectric material. In this initial stage, we have focused on studying the evolution of the microstructure. The cast material has a random, mm-scale grain structure. As the material is deformed, there is a strong tendency toward a bimodal grain size distribution. Much of the sample readily refines to a fine grain size of ~10 microns, while the remainder maintains a coarse grain size of ~300 microns even after a large amount of plastic strain is imparted. We have found that the coarse grains are Bi-rich, while the fine grains are Sb-rich. An intermediate heat treatment that improved chemical homogeneity also improved microstructure uniformity achieved in subsequent multi-pass ECAE processing. We consider possible mechanisms by which chemical inhomogeneity leads to non-uniform grain refinement in Bi1-xSbx. In addition to homogeneity, texture is required to make good quality Bi1-xSbx alloys. Pole figure analyses of our samples show that the ECAE process can be effective in creating crystallographic texture.
Keywords :
antimony alloys; bismuth alloys; crystal microstructure; extrusion; grain refinement; grain size; heat treatment; texture; thermoelectricity; Bi90Sb10; bimodal grain size distribution; cast billets; chemical homogeneity; chemical inhomogeneity; crystallographic texture; equal channel angle extrusion; grain structure; heat treatment; microstructure; n-type thermoelectric material; nonuniform grain refinement; plastic strain; polycrystalline form; Billets; Bismuth; Capacitive sensors; Chemical processes; Grain size; Heat treatment; Microstructure; Plastics; Thermoelectricity; Tin alloys;
Conference_Titel :
Thermoelectrics, 2007. ICT 2007. 26th International Conference on
Conference_Location :
Jeju Island
Print_ISBN :
978-1-4244-2262-3
Electronic_ISBN :
1094-2734
DOI :
10.1109/ICT.2007.4569507