• DocumentCode
    2198491
  • Title

    Protein Adsorption and Biocompatibility of Porous Silk Fiboin Films

  • Author

    Sun Zi Ling ; Bai Lun ; Guan Guo Ping ; Zhan Kui Hua ; Dai Hong Qin

  • Author_Institution
    Coll. of Textile & Clothing Eng., Soochow Univ., Suzhou, China
  • fYear
    2009
  • fDate
    17-19 Oct. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Silk fibroins are widely used in skin wound healing and tissue engineering scaffolds. This study sought to observe proteins adsorption and biocompatibility. Bradford protein assay revealed that the amount of adsorbed proteins was significantly less than that on PVA. The Sodium Dodecyl Sulfate Polyacrylamidege Electrophoresis (SDS-PAGE) indicated that more proteins adsorbed onto PVA than that PSFFs. Identification of adsorbed proteins by Western blotting revealed that there was lesser amount of fibrinogen on PSFFs than on PVA. Histologic observation after 10 days PSFFs implantation in shin and muscle of rat showed that some capillaries and microvessels grew in PSFFs, PSFFs and peritissues were mixed with each other, many fibroblasts, myocytes and lipocytes could be observed in PSFFs due to good biocompatibility.
  • Keywords
    adsorption; biomedical materials; cellular biophysics; porous materials; proteins; tissue engineering; Bradford protein assay; SDS-PAGE; Sodium Dodecyl Sulfate Polyacrylamidege Electrophoresis; Western blotting; biocompatibility; capillaries; fibroblasts; histologic observation; lipocytes; microvessels; myocytes; peritissues; porous silk fiboin films; protein adsorption; rat muscle; rat shin; skin wound healing; tissue engineering scaffolds; Adhesives; Biological materials; Biomedical materials; Biomembranes; Educational institutions; Electrokinetics; Plasma chemistry; Plasma temperature; Protein engineering; Sun;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Biomedical Engineering and Informatics, 2009. BMEI '09. 2nd International Conference on
  • Conference_Location
    Tianjin
  • Print_ISBN
    978-1-4244-4132-7
  • Electronic_ISBN
    978-1-4244-4134-1
  • Type

    conf

  • DOI
    10.1109/BMEI.2009.5305691
  • Filename
    5305691