Time domain analysis of a through hole via with time dependent skin effect model

Author

Xiao-Ding Cai ; Costache, G.I.

Author_Institution

Semicond. Components Group, Northern Telecom Ltd., Nepean, Ont., Canada

Volume

2

fYear

1995

fDate

24-27 Jul 1995

Firstpage

862

Abstract

This paper presents a transient simulation of a through hole via connecting transmission lines on both sides of a printed circuit board. The via is modeled by a lumped RLC equivalent circuit that takes into account the skin effect in the cylindrical conductor. In the analysis of the transmission line part, a new skin effect model accounting for the time dependent losses is included. A mathematical interface is established between discrete time domain solutions and a lumped element RLC circuit. Numerical results show reasonable response due to the through hole via

Keywords

equivalent circuits; lumped parameter networks; microstrip couplers; microstrip discontinuities; printed circuits; skin effect; time-domain analysis; transient analysis; waveguide theory; connecting transmission lines; cylindrical conductor; discrete time domain solutions; lumped RLC equivalent circuit; mathematical interface; printed circuit board; through hole via; time dependent losses; time dependent skin effect model; Circuit simulation; Conductors; Distributed parameter circuits; Equivalent circuits; Joining processes; Power system transients; Printed circuits; Propagation losses; Skin effect; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Optoelectronics Conference, 1995. Proceedings., 1995 SBMO/IEEE MTT-S International

Conference_Location

Rio de Janeiro

Print_ISBN

0-7803-2674-1

Type

conf

DOI

10.1109/SBMOMO.1995.509728

Filename

509728