DocumentCode :
2200857
Title :
Patterned Polymer Bonding with 3-D capability for Microelectromechanical Systems (MEMS) Inertial Sensors
Author :
Tuck, Eric J. ; Tuck, Gerald ; Buncick, Milan ; Hudson, Tracy ; Buckner, Tom
fYear :
2006
fDate :
April 25-27, 2006
Firstpage :
599
Lastpage :
605
Keywords :
Etching; Hafnium; Microelectromechanical systems; Micromechanical devices; Polymers; Sensor arrays; Sensor systems; Silicon; Temperature sensors; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Position, Location, And Navigation Symposium, 2006 IEEE/ION
Print_ISBN :
0-7803-9454-2
Type :
conf
DOI :
10.1109/PLANS.2006.1650650
Filename :
1650650
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2200857
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