DocumentCode
2200857
Title
Patterned Polymer Bonding with 3-D capability for Microelectromechanical Systems (MEMS) Inertial Sensors
Author
Tuck, Eric J. ; Tuck, Gerald ; Buncick, Milan ; Hudson, Tracy ; Buckner, Tom
fYear
2006
fDate
April 25-27, 2006
Firstpage
599
Lastpage
605
Keywords
Etching; Hafnium; Microelectromechanical systems; Micromechanical devices; Polymers; Sensor arrays; Sensor systems; Silicon; Temperature sensors; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Position, Location, And Navigation Symposium, 2006 IEEE/ION
Print_ISBN
0-7803-9454-2
Type
conf
DOI
10.1109/PLANS.2006.1650650
Filename
1650650
Link To Document