Title :
Package Level Simulation and Verification of Microsystems
Author :
Song, Jing ; Li, Ming ; Huang, Qing-An ; Tang, Jie-ying
Author_Institution :
Southeast Univ., Nanjing
Abstract :
This paper presents a modified concept of a generalized nodal analysis method (NAM) to theoretically model the packaged MEMS device and simplify the package-level simulation of microsystems. Non-device elements are included and a new kind of distributed node is defined to expand the usability of NAM. Experiment verification based on DSCM and LDV are also carried out to validate the simulated results.
Keywords :
micromechanical devices; semiconductor device packaging; distributed node; generalized nodal analysis method; microsystems; package level simulation; packaged MEMS device; Analytical models; Integrated circuit modeling; Integrated circuit packaging; Laboratories; Microelectromechanical devices; Micromechanical devices; Semiconductor device measurement; Testing; Thermal stresses; Usability;
Conference_Titel :
Sensors, 2007 IEEE
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-1261-7
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2007.4388345
