DocumentCode :
2203564
Title :
High speed 15 ns 4 Mbits SRAM for space application
Author :
Coloma, Bernard ; Delaunay, Patrick ; Husson, Olivier
fYear :
2002
fDate :
2002
Firstpage :
226
Lastpage :
230
Abstract :
A high speed 15 ns 4 Mbits asynchronous SRAM, 500 μA stand-by current, 300 krads total dose tolerant, has been developed for space applications, using a hardened 0.25 micron 4 layers metal full CMOS process. A hierarchical organisation per IO bits has been used to achieve high speed as well as low dynamic consumption, also suited for simple SEU (single event upset) induced error corrections, allowing mitigation with the classical EDAC corrector. The product operates within 3 to 3.6 V, and ambient temperature from -55 to +125°C. A high density die size of 68.3 mm2 allows the use of a specific 36-pins dual in line flat pack package with a 500 mils width, making this product very competitive against SEU hardened chips. Successful silicon results are presented as well as radiation tests up to 300 krads.
Keywords :
CMOS memory circuits; SRAM chips; asynchronous circuits; high-speed integrated circuits; integrated circuit reliability; radiation hardening (electronics); space vehicle electronics; -55 to 125 degC; 15 ns; 3 to 3.6 V; 300 krad; 36-pin DIL package; 4 Mbit; 500 muA; SEU hardened chip; SEU induced error corrections; asynchronous SRAM; dual in line flat pack package; four metal layers full CMOS process; hardened CMOS process; high speed SRAM; low dynamic consumption; radiation tests; single event upset; space applications; total dose tolerant SRAM; CMOS process; Circuits; Clocks; Decoding; Latches; Photonic band gap; Random access memory; Regulators; Single event upset; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
On-Line Testing Workshop, 2002. Proceedings of the Eighth IEEE International
Print_ISBN :
0-7695-1641-6
Type :
conf
DOI :
10.1109/OLT.2002.1030223
Filename :
1030223
Link To Document :
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