Title :
Progress in development of advanced package for semiconductor device
Author :
Zheng, Hongyu ; Gao, Ling ; Liu, Zhiping
Author_Institution :
Hebei Semicond. Res. Inst., China
Abstract :
This paper summarizes the progress in development of advanced packaging for semiconductor devices in our lab of HSRI during the past years. The main scope will deal with the achievement of packaging basic research and various packaging products for discrete devices, IC, MEMS and optoelectronics devices
Keywords :
ball grid arrays; ceramic packaging; integrated circuit packaging; micromechanical devices; multichip modules; optoelectronic devices; semiconductor device packaging; BGA; IC packaging; MCM; MEMS; PGA; advanced packaging; ceramic packaging; discrete devices; low dielectric constant material; microwave device package; optoelectronic devices; package design; packaging CAD; semiconductor device; Ceramics; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Metallization; Micromechanical devices; Optical devices; Semiconductor device packaging; Semiconductor devices; Thermal conductivity;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6520-8
DOI :
10.1109/ICSICT.2001.981430
