DocumentCode
2204668
Title
Integrated circuit cofired laminated ceramic package antenna
Author
Zhang, Y.P.
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Volume
1
fYear
2001
fDate
2001
Firstpage
100
Abstract
A novel concept to implement an antenna on an integrated circuit package is proposed for the single-chip solution of a wireless transceiver using deep submicron CMOS technology. The prototype antenna printed on a 40-pin dual-in-line cofired laminated ceramic package is experimentally studied at 3.45 GHz. The results show that the antenna has achieved a bandwidth of 25.1% and a gain of -2.0 dBi
Keywords
CMOS integrated circuits; antenna radiation patterns; ceramic packaging; integrated circuit packaging; microstrip antennas; transceivers; 3.45 GHz; DIL cofired laminated ceramic package; IC package antenna; deep submicron CMOS technology; dual-in-line package; integrated circuit package; printed antenna; single-chip wireless transceiver; Bandwidth; CMOS technology; Ceramics; Electronics packaging; Integrated circuit packaging; Integrated circuit technology; Metallization; Prototypes; Semiconductor device packaging; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location
Shanghai
Print_ISBN
0-7803-6520-8
Type
conf
DOI
10.1109/ICSICT.2001.981432
Filename
981432
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