Research on thermal characteristics and on-chip temperature-controlling for silicon micro-gyroscope

This paper presents a novel gyroscope prototype with on-chip heater and temperature sensor to keep gyroscope uninfluenced by environmental temperature. It firstly introduced the gyroscope´s working principle and deduced its temperature dependence to get performances´ temperature sensitivity. It turns out capacitive sensitivity has a variation of 13.5 % when gyroscope´s working temperature has a change of 50 K. Then the gyroscope prototype with on-chip temperature-controlling was given and its performances were analyzed theoretically and numerically. Besides, fabrication process was designed based on Silicon-On-Glass (SOG) technology. Simulation results indicate that, to keep gyroscope´s temperature at 60°C with a temperature difference between center mass and anchor below 1.6°C, the power consumption increases from 0.011 W to 0.213 W when environmental temperature decreases from 55°C to -40°C. When environmental temperature is 20°C and consumption power is 0.0884 W, gyroscope can reach its equilibrium state of 60°C from 20°C within 20s. Stress intensities inside gyroscope are less than the ultimate tensile or compressive strength of each material. It theoretically proves that the prototype meets the three demands of low power consumption, even temperature distribution and quick thermal response. Hopefully, the prototype can be manufactured and tested in the future.