DocumentCode

2205106

Title

Automated Inspection Of IC Bonding Wires Using Hough Transforf4

Author

King N. Ngan

Author_Institution

University of Singapore

Volume

4

fYear

1988

fDate

24-28 Oct. 1988

Firstpage

938

Lastpage

942

Keywords

Bonding; Cameras; Equations; Humans; Image edge detection; Inspection; Machine vision; Microassembly; Packaging; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Industrial Electronics Society, 1988. IECON '88. Proceedings., 14 Annual Conference of

Conference_Location

Singapore

Type

conf

DOI

10.1109/IECON.1988.666270

Filename

666270