Preparation and magnetic properties of silane modified Ni-Zn ferrite and its epoxy composites

Author

Wu, Yanmin ; Zhu, Pengli ; Sun, Rong

Author_Institution

Shenzhen Institutes of Adv. Technol., Chinese Acad. of Sci., Shenzhen, China

fYear

2011

fDate

6-8 June 2011

Firstpage

879

Lastpage

881

Abstract

Ni-Zn ferrite/epoxy composites were investigated for embedded inductors. Ni-Zn ferrite powder was prepared by a chemical coprecipitation method, and then modified with γ-glycidoxypropyl trimethoxysilane (KH-560). The unmodified ferrite was characterized by a powder X-ray diffraction (XRD) and vibrating sample magnetometer (VSM). The XRD curve showed that the ferrite was typical spinel structure, and the measuring result of the VSM indicated that the initial permeability of the ferrite was about 1225.03. The magnetic epoxy composites were respectively fabricated by mixing the modified or unmodified ferrite and epoxy resin. The composites made from the modified-ferrite exhibited better dispersion than that from the unmodified. Magnetic properties of composites were measured by Agilent E 4991 A. The results showed that the permeability of the epoxy composite was rising from 1.4 to 2.1 with the mass fraction of the ferrite increasing in the composite from 30% ~ 70%, and magnetic loss was low.

Keywords

X-ray diffraction; composite materials; ferrites; inductors; magnetic permeability; magnetometers; materials preparation; nickel; precipitation; resins; zinc; γ-glycidoxypropyl trimethoxysilane; Ni-Zn; XRD; chemical coprecipitation method; embedded inductors; epoxy resin; ferrite permeability; magnetic epoxy composites; magnetic loss; magnetic property; mass fraction; powder X-ray diffraction; silane modified Ni-Zn ferrite; spinel structure; vibrating sample magnetometer; Ferrites; Magnetic hysteresis; Magnetic losses; Magnetic properties; Magnetometers; Permeability; Soft magnetic materials; epoxy composites; ferrite; permeability;

fLanguage

English

Publisher

ieee

Conference_Titel

Information and Automation (ICIA), 2011 IEEE International Conference on

Conference_Location

Shenzhen

Print_ISBN

978-1-4577-0268-6

Electronic_ISBN

978-1-4577-0269-3

Type

conf

DOI

10.1109/ICINFA.2011.5949119

Filename

5949119