DocumentCode :
2206150
Title :
Development of an EPR tape molded joint (RMJ) for 154 kV XLPE cables with reduced insulation thickness
Author :
Suzuki, Jun ; Okuyama, Seiichi ; Yagi, Shigeki ; Ishibashi, Atsuhiko ; Komatsu, Kouji ; Matsui, To
Author_Institution :
Fujikura Ltd., Tokyo, Japan
Volume :
2
fYear :
1998
fDate :
7-10 Jun 1998
Firstpage :
566
Abstract :
Cross-linked polyethylene-insulated (XLPE) cables are widely used for extra-high voltage power transmission lines, replacing oil filled (OF) cables due to their advantages in maintenance and environmental impact. In recent years, electrical performances of XLPE cables have been improved; however, increasing demands for power and overcrowding in urban and suburban underground facilities require further improvements to increase current transmission capacities and minimize dimensions. We are investigating the applications of 154 kV XLPE cables with reduced insulation thickness to existing ducts which am already installed. These applications require the development of smaller joints that can be installed in manholes for OF cables. Therefore we are developing ethylene-propylene rubber (EPR) tape type molded joint (MJ) methods to improve conventional joint technologies. This paper reports on the relationships between the electrical performances of MJ and the interface properties of EPR/XLPE
Keywords :
XLPE insulation; cable jointing; ethylene-propylene rubber; power cable insulation; underground cables; underground transmission systems; 154 kV; EPR tape molded joint; XLPE cables; current transmission capacities; environmental impact; ethylene-propylene rubber tape; extra-high voltage power transmission lines; insulation thickness; maintenance; molded joint; underground facilities; Cable insulation; Conductors; Dielectrics and electrical insulation; Flowcharts; Manufacturing; Paramagnetic resonance; Performance evaluation; Space technology; Testing; Wrapping;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation, 1998. Conference Record of the 1998 IEEE International Symposium on
Conference_Location :
Arlington, VA
ISSN :
1089-084X
Print_ISBN :
0-7803-4927-X
Type :
conf
DOI :
10.1109/ELINSL.1998.694856
Filename :
694856
Link To Document :
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