Title :
Temperature estimation of ULSI metallization systems
Author :
Xiao, X. ; Ruan, G. ; Zhu, Z.M. ; Gessner, T.
Author_Institution :
Center of Microtechnologies, Chemnitz Univ. of Technol., Germany
Abstract :
The problem of heat dissipation of interconnection systems of ULSI circuits becomes more critical with the application of low dielectric constant materials, the increase of interconnect levels and the current density. In this study, thermal behavior of many interconnection cases are investigated by applying a set of compact quasi-analytic equations for estimating the temperature distribution on the interconnection system as well as by numerical simulation
Keywords :
ULSI; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; temperature distribution; ULSI metallization systems; current density; heat dissipation; interconnect levels; interconnection systems; low dielectric constant material; temperature distribution; temperature estimation; Dielectric constant; Dielectric materials; Dielectric substrates; Equations; Integrated circuit interconnections; Metallization; Power system interconnection; Temperature distribution; Thermal conductivity; Ultra large scale integration;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6520-8
DOI :
10.1109/ICSICT.2001.981498
