Thermal Characterization of the Micro Bonding Process Using a Hot Air Stream

The possible solution for bonding two different materials with intermediate layer of adhesive at relatively low temperatures in the micro domain is proposed in this paper. A stream of hot gas has been used for melting and softening different kinds of adhesives. After cooling down at room temperature, adhesives harden forming a stable and strong bond. The gas is heated as it passes through the tube with the heater developed on it. The parameters which induce the heat transfer and the process performance generally are considered through various experiments and by numerical simulations. Some advantages of this process are applicability for different material combinations, cost and time efficiency, compact size of equipment etc