Title :
Self-assembled epitaxial CoSi2/Si(100) nanostructures
Author :
Kluth, P. ; Zhao, Q.T. ; Winnerl, S. ; Lenk, S. ; Mantl, S.
Author_Institution :
Inst. of Thin Films & Interfaces, Forschungszentrum Julich GmbH, Germany
Abstract :
We have developed a method for fabricating self-assembled epitaxial CoSi2-nanostructures using only conventional optical lithography and standard silicon processing steps. This method was successfully applied to ultra-thin epitaxial CoSi2 layers grown on Si(100) and silicon-on-insulator (SOI) substrates. A nitride mask induces a stress field near its edges into the CoSi2/Si heterostructure and leads to the separation of the CoSi2 layer in this region during a rapid thermal oxidation step. Highly uniform gaps with dimensions down to 40 nm appear along the edge of the mask. Combined with selective etching we achieved highly homogenous silicide wires with diameters down to 50 nm. The generated gaps and wires can be used as building blocks for silicon-nanodevices such as NanoMOSFETs
Keywords :
cobalt compounds; elemental semiconductors; etching; masks; nanostructured materials; nanotechnology; oxidation; photolithography; rapid thermal processing; self-assembly; semiconductor-metal boundaries; silicon; solid phase epitaxial growth; 40 nm; 50 nm; CoSi2-Si; SOI; Si; Si(100); Si-SiO2; building blocks; gaps; homogenous silicide wires; nitride mask; optical lithography; rapid thermal oxidation; selective etching; self-assembled epitaxial CoSi2/Si(100) nanostructures; silicon nanodevices; silicon processing; silicon-on-insulator; stress field; ultra-thin epitaxial layers; Etching; Lithography; Nanostructures; Optical films; Oxidation; Self-assembly; Silicides; Silicon; Substrates; Thermal stresses;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6520-8
DOI :
10.1109/ICSICT.2001.981523