DocumentCode :
2206939
Title :
Charging damage in metal-oxide-metal capacitors
Author :
Harris, E.B. ; Gregor, R.W. ; Dennis, D.C. ; Lai, T.T. ; Sen, S. ; Yan, Y.F. ; Esry, T. ; Pita, M.
Author_Institution :
Lucent Technol., AT&T Bell Labs., Orlando, FL, USA
fYear :
1998
fDate :
4-5 Jun 1998
Firstpage :
15
Lastpage :
17
Abstract :
The magnetically enhanced reactive ion etching (MERIE) process is well known for causing charging damage to thin gate oxide. Damage to thin gate oxide by the Ar fillet process has been documented (Stamper et al., 1995). In this paper, charging damage to metal-oxide-metal (MOM) capacitors, often used in analog circuits, is reported. The dielectrics in these MOM capacitors are much thicker than gate oxides and the antenna ratios are typically near unity. One therefore does not expect these capacitors to suffer from charging damage easily. However, we found these MOM capacitors to be very sensitive to charging damage. We argue that the sensitivity of these capacitors is actually not surprising. Thicker oxides require higher voltage but less current to breakdown. Since antennae act as current amplifiers, thicker oxide does not require a large antenna ratio to become damaged as long as the plasma can supply the voltage. In addition, the dielectric in MOM capacitors is not of the same quality as gate oxides and therefore is more prone to damage
Keywords :
MIM devices; analogue integrated circuits; dielectric thin films; integrated circuit reliability; integrated circuit testing; plasma materials processing; sputter etching; thin film capacitors; AlCuSi-SiO2-TiN; MERIE process; MOM capacitor gate oxides; MOM capacitors; analog circuits; antenna ratio; antenna ratios; antenna structure current amplifier action; breakdown current; breakdown voltage; capacitor charging damage sensitivity; charging damage; dielectrics; gate oxides; magnetically enhanced RIE process; magnetically enhanced reactive ion etching process; metal-oxide-metal capacitors; oxide antenna ratio; plasma etching; plasma voltage; thin gate oxide charging damage; Argon; Breakdown voltage; Capacitors; Circuits; Dielectrics; Etching; Magnetic fields; Message-oriented middleware; Plasma applications; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Process-Induced Damage, 1998 3rd International Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
0-9651577-2-5
Type :
conf
DOI :
10.1109/PPID.1998.725563
Filename :
725563
Link To Document :
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