• DocumentCode
    2207077
  • Title

    Charging damage in thin gate-oxides-better or worse?

  • Author

    Cheung, K.P. ; Liu, C.T. ; Chang, C.P. ; Colonell, J.I. ; Lai, W.Y.C. ; Pai, C. ; Vaidya, H. ; Liu, R. ; Clemens, J.T. ; Hasegawa, E.

  • Author_Institution
    AT&T Bell Labs., Murray Hill, NJ, USA
  • fYear
    1998
  • fDate
    4-5 Jun 1998
  • Firstpage
    34
  • Lastpage
    37
  • Abstract
    The question of whether or not thinner gate oxide is less susceptible to plasma charging damage depends on a number of factors. One important factor is the definition of damage itself. The measurement method is linked to the definition of damage. When the charging current is low and charging voltage is high, thinner oxides are indeed far less prone to damage. When the charging current is high and charging voltage is low, as in most new plasma systems, thinner oxides are more susceptible to damage. In a very crude way, one may conclude that older plasma systems tend to belong to the low current, high charging voltage class, while modern plasma equipment tends to belong to the high current, low charging voltage class. In this sense, it is the concomitant change to high density plasma processing with advanced technology where thinner gate oxides are used that make plasma charging damage continue to be a major problem
  • Keywords
    integrated circuit testing; integrated circuit yield; plasma density; plasma materials processing; surface charging; surface treatment; Si; SiO2-Si; charging current; charging damage; charging voltage; damage definition; high density plasma processing; measurement method; plasma charging damage; plasma equipment; plasma systems; thin gate-oxides; Antenna measurements; Current measurement; Degradation; Design for quality; Leakage current; Plasma density; Stress; Time measurement; Tunneling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Process-Induced Damage, 1998 3rd International Symposium on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    0-9651577-2-5
  • Type

    conf

  • DOI
    10.1109/PPID.1998.725568
  • Filename
    725568