DocumentCode :
2207077
Title :
Charging damage in thin gate-oxides-better or worse?
Author :
Cheung, K.P. ; Liu, C.T. ; Chang, C.P. ; Colonell, J.I. ; Lai, W.Y.C. ; Pai, C. ; Vaidya, H. ; Liu, R. ; Clemens, J.T. ; Hasegawa, E.
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
fYear :
1998
fDate :
4-5 Jun 1998
Firstpage :
34
Lastpage :
37
Abstract :
The question of whether or not thinner gate oxide is less susceptible to plasma charging damage depends on a number of factors. One important factor is the definition of damage itself. The measurement method is linked to the definition of damage. When the charging current is low and charging voltage is high, thinner oxides are indeed far less prone to damage. When the charging current is high and charging voltage is low, as in most new plasma systems, thinner oxides are more susceptible to damage. In a very crude way, one may conclude that older plasma systems tend to belong to the low current, high charging voltage class, while modern plasma equipment tends to belong to the high current, low charging voltage class. In this sense, it is the concomitant change to high density plasma processing with advanced technology where thinner gate oxides are used that make plasma charging damage continue to be a major problem
Keywords :
integrated circuit testing; integrated circuit yield; plasma density; plasma materials processing; surface charging; surface treatment; Si; SiO2-Si; charging current; charging damage; charging voltage; damage definition; high density plasma processing; measurement method; plasma charging damage; plasma equipment; plasma systems; thin gate-oxides; Antenna measurements; Current measurement; Degradation; Design for quality; Leakage current; Plasma density; Stress; Time measurement; Tunneling; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Process-Induced Damage, 1998 3rd International Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
0-9651577-2-5
Type :
conf
DOI :
10.1109/PPID.1998.725568
Filename :
725568
Link To Document :
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