• DocumentCode
    2207807
  • Title

    Correlation between plasma-induced gate oxide damage and charging sensor measurements

  • Author

    Alba, S. ; Ghio, E. ; Micciche, G. ; Valentini, G. ; Batani, D.

  • Author_Institution
    SGS-Thomson Microelectron., Milan, Italy
  • fYear
    1998
  • fDate
    4-5 Jun 1998
  • Firstpage
    140
  • Lastpage
    143
  • Abstract
    This paper describes for the first time a methodology which allows direct correlation between charging potential, measured under actual process conditions using a flash memory cell as a charging sensor, and “latent” oxide damage revealed through FN injection on transistors. The methodology was used to study charging effects in a transformer-coupled plasma (TCP) metal etcher under actual process conditions, as a function of antenna shape. Significant Vth shifts after FN injection were found only with very dense “finger” antennas, revealing enhanced oxide damage due to the “electron shading” effects. The oxide damage is strictly correlated with charging potential using flash memory cells with the same antenna structures as the transistors
  • Keywords
    CMOS memory circuits; dielectric thin films; electric sensing devices; flash memories; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; plasma materials processing; sputter etching; surface charging; CMOS flash memory process; FN injection; Si; SiO2-Si; TCP metal etcher; antenna shape; charging effects; charging potential; charging sensor measurements; electron shading effects; enhanced oxide damage; finger antennas; flash memory cell antenna structures; flash memory cell charging sensor; flash memory cells; latent oxide damage; oxide damage correlation; plasma-induced gate oxide damage; process conditions; threshold voltage shifts; transformer-coupled plasma metal etcher; transistor antenna structures; transistors; Antenna measurements; Electrodes; Electrons; Etching; Fingers; Flash memory cells; Plasma applications; Plasma measurements; Sensor phenomena and characterization; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Process-Induced Damage, 1998 3rd International Symposium on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    0-9651577-2-5
  • Type

    conf

  • DOI
    10.1109/PPID.1998.725594
  • Filename
    725594