DocumentCode :
2207884
Title :
Defects and strain in H+ and He+ co-implanted silicon
Author :
Lin, Chenglu ; Duo, Xinzhong ; Zhang, Miao ; Wang, SX ; Wang, L.M.
Author_Institution :
Inst. of Metall., Acad. Sinica, Shanghai, China
Volume :
1
fYear :
2001
fDate :
2001
Firstpage :
650
Abstract :
In this paper we studied the process of blistering and exfoliation on the crystal silicon surface and evolution of defects and strain in crystal silicon caused by hydrogen and helium co-implantation. It is shown that H+ and He+ co-implantation would produce a synergistic effect, which decrease the total implantation dose greatly, compared with the single ion implantation. We have also presented the effect of co-implantation and analyzed the different role of H+ and He+ in the process of exfoliation during annealing. It seems that the essential role of hydrogen is to interact chemically with the defects in silicon and create the H-stabled platelets, while the role of helium is to effuse into these platelets and assert pressure on the inner surface of these platelets
Keywords :
annealing; elemental semiconductors; extended defects; helium; hydrogen; internal stresses; ion implantation; silicon; Si:H,He; annealing; blistering; co-implantation; crystal surface; exfoliation; extended defects; implantation dose; platelets; strain; Annealing; Backscatter; Capacitive sensors; Helium; Hydrogen; Ion implantation; Semiconductor thin films; Separation processes; Silicon; Spectroscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6520-8
Type :
conf
DOI :
10.1109/ICSICT.2001.981563
Filename :
981563
Link To Document :
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