DocumentCode
2207884
Title
Defects and strain in H+ and He+ co-implanted silicon
Author
Lin, Chenglu ; Duo, Xinzhong ; Zhang, Miao ; Wang, SX ; Wang, L.M.
Author_Institution
Inst. of Metall., Acad. Sinica, Shanghai, China
Volume
1
fYear
2001
fDate
2001
Firstpage
650
Abstract
In this paper we studied the process of blistering and exfoliation on the crystal silicon surface and evolution of defects and strain in crystal silicon caused by hydrogen and helium co-implantation. It is shown that H+ and He+ co-implantation would produce a synergistic effect, which decrease the total implantation dose greatly, compared with the single ion implantation. We have also presented the effect of co-implantation and analyzed the different role of H+ and He+ in the process of exfoliation during annealing. It seems that the essential role of hydrogen is to interact chemically with the defects in silicon and create the H-stabled platelets, while the role of helium is to effuse into these platelets and assert pressure on the inner surface of these platelets
Keywords
annealing; elemental semiconductors; extended defects; helium; hydrogen; internal stresses; ion implantation; silicon; Si:H,He; annealing; blistering; co-implantation; crystal surface; exfoliation; extended defects; implantation dose; platelets; strain; Annealing; Backscatter; Capacitive sensors; Helium; Hydrogen; Ion implantation; Semiconductor thin films; Separation processes; Silicon; Spectroscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location
Shanghai
Print_ISBN
0-7803-6520-8
Type
conf
DOI
10.1109/ICSICT.2001.981563
Filename
981563
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