• DocumentCode
    2207884
  • Title

    Defects and strain in H+ and He+ co-implanted silicon

  • Author

    Lin, Chenglu ; Duo, Xinzhong ; Zhang, Miao ; Wang, SX ; Wang, L.M.

  • Author_Institution
    Inst. of Metall., Acad. Sinica, Shanghai, China
  • Volume
    1
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    650
  • Abstract
    In this paper we studied the process of blistering and exfoliation on the crystal silicon surface and evolution of defects and strain in crystal silicon caused by hydrogen and helium co-implantation. It is shown that H+ and He+ co-implantation would produce a synergistic effect, which decrease the total implantation dose greatly, compared with the single ion implantation. We have also presented the effect of co-implantation and analyzed the different role of H+ and He+ in the process of exfoliation during annealing. It seems that the essential role of hydrogen is to interact chemically with the defects in silicon and create the H-stabled platelets, while the role of helium is to effuse into these platelets and assert pressure on the inner surface of these platelets
  • Keywords
    annealing; elemental semiconductors; extended defects; helium; hydrogen; internal stresses; ion implantation; silicon; Si:H,He; annealing; blistering; co-implantation; crystal surface; exfoliation; extended defects; implantation dose; platelets; strain; Annealing; Backscatter; Capacitive sensors; Helium; Hydrogen; Ion implantation; Semiconductor thin films; Separation processes; Silicon; Spectroscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-6520-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2001.981563
  • Filename
    981563