DocumentCode :
2208178
Title :
Ferroelectric dielectric technology
Author :
Nozawa, Hiroshi ; Takayama, Masao ; Koyama, Shinzo
Author_Institution :
Graduate Sch. of Energy Sci., Kyoto Univ., Japan
Volume :
1
fYear :
2001
fDate :
2001
Firstpage :
687
Abstract :
Ferroelectric thin film, which is a kind of functional dielectric, especially provided with hysteresis characteristics in P-E curve, has drawn wide attention in the LSI field, because of its ideal features, like nonvolatility and fast programming operation at low voltage. From various points of view, for example, academic, industry and so on, basic studies have been drastically advanced for this decade. Recently, ferroelectric memory, called FeRAM, succeeds practically in volume production. At this stage, interestis in the theoretical prediction of life of the products and their application to logic devices. This paper has described a leading study on reliability physics and some applications of ferroelectric dielectric technology. Finally promising perspectives on the ferroelectric dielectric technology are shown
Keywords :
dielectric hysteresis; dielectric polarisation; equivalent circuits; ferroelectric capacitors; ferroelectric storage; random-access storage; LSI; bistable states; domain pinning; equivalent circuits; fast programming operation; ferroelectric capacitor; ferroelectric dielectric technology; ferroelectric memory; ferroelectric thin film; high performance; hysteresis characteristics; imprint phenomenon; instability modeling; logic devices; low voltage; nonvolatile memories; perovskite structure; polarization fatigue; reliability; temperature dependence; thermionic field emission; volume production; Dielectric thin films; Ferroelectric films; Ferroelectric materials; Functional programming; Hysteresis; Large scale integration; Low voltage; Nonvolatile memory; Production; Random access memory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
0-7803-6520-8
Type :
conf
DOI :
10.1109/ICSICT.2001.981597
Filename :
981597
Link To Document :
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