Title :
A Fast Wafer-level Test For Screening VLSI Metallization
Author :
Fu, Kuan-Yu ; Mohanti, Tapan
Author_Institution :
Motorola Semiconductor Products Sector
Keywords :
Current density; Dielectrics; Fabrication; Heating; Life testing; Metallization; Temperature; Thermal conductivity; Thermal resistance; Very large scale integration;
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
DOI :
10.1109/IRWS.1993.666287
