Analysis Of Multilayered Microstrip Using Collocation Method

A new quasi-static analysis of multilayer micro strip structure using low dielectric constant polyimide as a buffer layer between the micro strip conductor and the GaAS substrate to reduce dissipation loss is presented using collocation method. Collocation method is a true mesh less technique which scores the advantage of CPU time over the conventional mesh methods. Numerical results for effective dielectric constant, characteristic impedances for multilayer micro strip structures are presented and discussed. Comparisons are also made of the computed results with the available methods and good agreements are obtained