Title :
Reducing material use in protective packaging for computer products
Author_Institution :
Digital Equipment Corp., Maynard, MA, USA
Abstract :
This paper describes the program Digital Equipment Corporation has put in place to address the reduction of packaging wastes and costs. The principles and some of the issues associated with the two phases of the program are described: improvements to existing packaging, and packaging reduction through the new product development process. Examples of various types of projects from both phases are used to illustrate the work of the program and some of the opportunities for packaging reduction in the electronics industry
Keywords :
DP industry; packaging; waste disposal; computer products; electronics industry; material use reduction; packaging costs reduction; packaging wastes; protective packaging; Costs; Electronics packaging; Manufacturing; Packaging machines; Product development; Protection; Raw materials; Recycling; Solids; Waste materials;
Conference_Titel :
Electronics and the Environment, 1994. ISEE 1994., Proceedings., 1994 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-1769-6
DOI :
10.1109/ISEE.1994.337239
