DocumentCode
2210386
Title
A systematic methodology of material selection with environmental considerations
Author
Chen, Rosy W. ; Navin-Chandra, D. ; Kurfess, T. ; Prinz, F.
Author_Institution
Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
1994
fDate
2-4 May 1994
Firstpage
252
Lastpage
257
Abstract
Increasingly stringent regulations and widely expressed public concerns for the environment highlight the importance of making environmentally oriented decisions in product design. Traditionally, product design has been driven by marketing, economic, engineering, and manufacturing constraints. Until very recently, considerations of the impact that products have on the natural environment have not been included in design decision processes. Products affect the environment at various stages in their life cycle in many ways. Among them is the choice of materials used in the product. The key therefore is to bring environmental concerns into the material selection process. This paper presents a methodology for incorporating environmental considerations in the selection of materials at the design phase. The authors examine the environmental impacts of materials and develop a selection methodology. A case study of material selection in a housing of the electronic device is presented to illustrate their methodology for selecting materials that meet engineering and environmental requirements while maintaining the lowest cost to the manufacturer
Keywords
concurrent engineering; design engineering; packaging; pollution; research and development management; cost; design decision processes; engineering requirements; environmental considerations; life cycle; material selection; product design; systematic methodology; Conducting materials; Cost function; Design engineering; Maintenance engineering; Manufacturing processes; Material properties; Power generation economics; Process design; Product design; Waste materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 1994. ISEE 1994., Proceedings., 1994 IEEE International Symposium on
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-1769-6
Type
conf
DOI
10.1109/ISEE.1994.337249
Filename
337249
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