DocumentCode :
2210549
Title :
Fluid head-source reduction process technology
Author :
Bendz, Gerald A. ; Horan, Michael S. ; Jones, Jeffrey D. ; Tavares, Frank A.
Author_Institution :
Microelectronics Dept., IBM Corp., Endicott, NY, USA
fYear :
1994
fDate :
2-4 May 1994
Firstpage :
220
Lastpage :
223
Abstract :
The fluid head is an exciting new technology developed at IBM Endicott. It is based on the fluid bearing principle, where small volumes of high speed fluid, hold and support and process a panel. This process is confined very close to the product and is able to deliver controlled amounts of fluids resulting in: less water usage; emission reduction; better chemical containment; reduced atomization; less hazardous waste; and less energy consumption. In this paper, comparisons of equipment utilizing the fluid head in rinsing, and drying devices are compared with conventional dip and spray processes. Parameters of ionic contamination, debris removal, electrical usage, as well as water usage and reduction in floor space are compared
Keywords :
drying; energy conservation; printed circuit manufacture; IBM Endicott; PCB manufacture; chemical containment; debris removal; drying; electrical usage; emission reduction; fluid bearing principle; fluid head; high speed fluid; ionic contamination; less energy consumption; less hazardous waste; less water usage; panel processing; panel support; reduced atomization; rinsing; source reduction process technology; Counting circuits; Energy consumption; Magnetic heads; Printed circuits; Spraying;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and the Environment, 1994. ISEE 1994., Proceedings., 1994 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-1769-6
Type :
conf
DOI :
10.1109/ISEE.1994.337254
Filename :
337254
Link To Document :
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