• DocumentCode
    2210672
  • Title

    A first step in electronic ecodesign

  • Author

    Holt, H. Randolph

  • Author_Institution
    Dept. of Technol., Northern Kentucky Univ., Highland Heights, KY, USA
  • fYear
    1994
  • fDate
    2-4 May 1994
  • Firstpage
    191
  • Lastpage
    195
  • Abstract
    This paper lays a framework for the development of a methodology that includes environmental and energy conservation considerations in electronic design. Using the basic environmental principles of “reduce, reuse, and recycle”, a number of design areas are addressed and augmented to include environmental issues. The concept of a design budget that includes environmental costs is introduced, and some suggestions are made on using “the three Rs” during the actual design process. Additional techniques are suggested for printed-circuit boards, for determining the proper components, for system manufacturing, packaging, distribution/shipping, and product disposal suggestions are made on development activities to help electronic designers apply environmentally-friendly techniques to the design process and to make decisions on design alternatives. The paper concludes by discussing the current business climate and the acceptance by manufacturing companies of the ecodesign concept
  • Keywords
    electronic equipment manufacture; energy conservation; packaging; business climate; distribution; electronic design; electronic ecodesign; energy conservation; environmental considerations; environmental costs; environmentally-friendly techniques; manufacturing companies; packaging; printed-circuit boards; product disposal; recycling; shipping; system manufacturing; Costs; Energy consumption; Equations; Maintenance; Manufacturing industries; Manufacturing processes; Paper technology; Pollution measurement; Product design; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1994. ISEE 1994., Proceedings., 1994 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-1769-6
  • Type

    conf

  • DOI
    10.1109/ISEE.1994.337260
  • Filename
    337260