DocumentCode :
2210872
Title :
Microfabrication and Characterization of SiO2 Microcantilever for High Sensitive Moisture Sensor
Author :
Chen, Qi ; Fang, Ji ; Ji, Hai-Feng ; Varahramyan, Kody
Author_Institution :
Louisiana Tech Univ., Ruston
fYear :
2007
fDate :
28-31 Oct. 2007
Firstpage :
1436
Lastpage :
1439
Abstract :
As an outstanding sensor platform, surface-stress sensing microcantilevers have potential application in moisture detection. To enlarge the deflection of the microcantilever under surface stress induced by specific reactions, a new SiO2 microcantilever is developed which features a much lower Young´s modulus than conventional Si or SiNx microcantilevers. For comparing SiO2 cantilever with Si cantilevers, simulation of the cantilever sensor is given, resulting in good agreement with the experimental data. To fabricate this device, a new fabrication process using isotropic combined with anisotropic dry etching to release the SiO2 microcantilever beam by ICP (inductively coupled plasma) was developed and investigated. Attributed to the high sensitivity, significant deflection amplitude of the surface modified SiO2 microcantilever was observed upon exposure to one percentage relative humidity.
Keywords :
Young´s modulus; cantilevers; etching; humidity sensors; moisture; silicon compounds; SiO2; Young modulus; anisotropic dry etching; high sensitive moisture sensor; inductively coupled plasma; microcantilever deflection; moisture detection; relative humidity; surface-stress sensor; Anisotropic magnetoresistance; Dry etching; Fabrication; Moisture; Optical coupling; Particle beams; Plasma applications; Sensor phenomena and characterization; Silicon compounds; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2007 IEEE
Conference_Location :
Atlanta, GA
ISSN :
1930-0395
Print_ISBN :
978-1-4244-1261-7
Electronic_ISBN :
1930-0395
Type :
conf
DOI :
10.1109/ICSENS.2007.4388683
Filename :
4388683
Link To Document :
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