DocumentCode
2210946
Title
Electronic packaging adhesive fatigue life prediction using thermal cycling step-stress testing
Author
Tian, Xijin ; Prince, John L.
Author_Institution
Arizona Univ., Tucson, AZ, USA
fYear
2002
fDate
2002
Firstpage
628
Lastpage
635
Abstract
In this research, a methodology of using step-stress thermal cycling to predict fatigue life for a specific electronic packaging adhesive is established. Numerical solutions are generated using FEA software and these data are compared to test data
Keywords
adhesives; circuit analysis computing; circuit reliability; fatigue testing; finite element analysis; thermal analysis; thermal management (packaging); FEA software; computer simulation; electronic packaging adhesive fatigue life prediction; numerical solutions; reliability calculations; thermal cycling step-stress testing; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Fatigue; Frequency; Life estimation; Life testing; Software testing; Thermal loading; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability and Maintainability Symposium, 2002. Proceedings. Annual
Conference_Location
Seattle, WA
ISSN
0149-144X
Print_ISBN
0-7803-7348-0
Type
conf
DOI
10.1109/RAMS.2002.981713
Filename
981713
Link To Document