DocumentCode :
2211409
Title :
High Accuracy Die Mechanical Stress Measurement with the ATC04 Assembly Test Chip
Author :
Sweet, James N. ; Peterson, David W.
Author_Institution :
Sandia National Laboratories
fYear :
1993
fDate :
24-27 Oct 1993
Firstpage :
90
Lastpage :
97
Keywords :
Assembly; Integrated circuit packaging; Mechanical variables measurement; Piezoresistance; Reflow soldering; Semiconductor device measurement; Stress measurement; Temperature; Testing; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
Type :
conf
DOI :
10.1109/IRWS.1993.666296
Filename :
666296
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2211409
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