• DocumentCode
    2212033
  • Title

    Technological issues for high-density MRAM

  • Author

    Kim, Taewan ; Hwang, Injun ; Cho, Young-Jin ; Kim, Kwang-suk ; Kim, Keewon

  • Author_Institution
    Samsung Adv. Inst. of Technol., Suwon
  • Volume
    1
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    182
  • Lastpage
    182
  • Abstract
    Key attributes of MRAM (magnetoresistive random access memory) technology are known as non-volatility with high speed and density, radiation hardness, and unlimited endurance. A lot of results have been announced for commercial market. It is anticipated that MRAM would play an important role in future memory market through its unique, functional advantages. For high density MRAM as a standalone memory, several technological issues related with MRAM core cells should be preferentially solved, we demonstrated 1 Kbit MRAM array fabricated by combination of hybrid technology of standard deep sub-micron CMOS and MTJ process. The main issues in the array, which can be fundamental limitation of MRAM technology, are considered. The topic covers basic issues of deep sub-micron MRAM core cell and consider the work related to the MRAM issues, such as cell stability and switching process.
  • Keywords
    CMOS memory circuits; magnetic storage; magnetoresistive devices; random-access storage; semiconductor technology; MRAM array; MTJ process; cell stability; high-density MRAM; hybrid technology; magnetoresistive random access memory; standard deep sub-micron CMOS process; submicron MRAM core cell; switching process; technological issue; CMOS process; CMOS technology; Magnetoresistance; Random access memory; Stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
  • Conference_Location
    Gyeongju
  • Print_ISBN
    978-1-4244-0541-1
  • Electronic_ISBN
    978-1-4244-0541-1
  • Type

    conf

  • DOI
    10.1109/NMDC.2006.4388735
  • Filename
    4388735