DocumentCode
2212033
Title
Technological issues for high-density MRAM
Author
Kim, Taewan ; Hwang, Injun ; Cho, Young-Jin ; Kim, Kwang-suk ; Kim, Keewon
Author_Institution
Samsung Adv. Inst. of Technol., Suwon
Volume
1
fYear
2006
fDate
22-25 Oct. 2006
Firstpage
182
Lastpage
182
Abstract
Key attributes of MRAM (magnetoresistive random access memory) technology are known as non-volatility with high speed and density, radiation hardness, and unlimited endurance. A lot of results have been announced for commercial market. It is anticipated that MRAM would play an important role in future memory market through its unique, functional advantages. For high density MRAM as a standalone memory, several technological issues related with MRAM core cells should be preferentially solved, we demonstrated 1 Kbit MRAM array fabricated by combination of hybrid technology of standard deep sub-micron CMOS and MTJ process. The main issues in the array, which can be fundamental limitation of MRAM technology, are considered. The topic covers basic issues of deep sub-micron MRAM core cell and consider the work related to the MRAM issues, such as cell stability and switching process.
Keywords
CMOS memory circuits; magnetic storage; magnetoresistive devices; random-access storage; semiconductor technology; MRAM array; MTJ process; cell stability; high-density MRAM; hybrid technology; magnetoresistive random access memory; standard deep sub-micron CMOS process; submicron MRAM core cell; switching process; technological issue; CMOS process; CMOS technology; Magnetoresistance; Random access memory; Stability;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
Conference_Location
Gyeongju
Print_ISBN
978-1-4244-0541-1
Electronic_ISBN
978-1-4244-0541-1
Type
conf
DOI
10.1109/NMDC.2006.4388735
Filename
4388735
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