• DocumentCode
    2212317
  • Title

    A Hollow-GCPW (HGCPW) as Low-Loss and Wafer-Conductivity-Free Structure on a Single Silicon Wafer

  • Author

    Nishino, Tamotsu ; Yoshida, Yukihisa ; Suehiro, Yoshiyuki ; Lee, Sang-Seok ; Miyaguchi, Kenichi ; Fukall1i, Tatsuya ; Oh-hashi, Hideyuki ; Ishida, Osami

  • Author_Institution
    Mitsubishi Electric Co. Information Technology R&D Center, Tel: +81-467-41-2686, Fax: +81-467-41-2519, e-mail: nishino@isl.melco.co.jp
  • fYear
    2003
  • fDate
    Oct. 2003
  • Firstpage
    41
  • Lastpage
    44
  • Abstract
    A low-loss hollow grounded co-planar Waveguide (HGCPW) suitable for a transmission line on a low-resistivity silicon wafer is presented. The HGCPW is disposed in a newly developed dielectric-air-metal (DAM) cavity. which consists of an SiN membrane above a fully metallized cavity made by a micromachining process. Low-loss property is achieved by removing substrate between a signal line and grounds. Existence of a bottom ground metal realizes wafer-conducthity-free structure on a low-resistivity silicon wafer by isolating the line from the substrate completely. Also, the bottom ground enables the impedance to be 50 ohm with narrow line width. HGCPWs on the 6-¿m and 30-¿m DAM cavities were fabricated and tested. The measured losses were about 0.3 dB/mm and 0.1 dB/mm respectively at 12 GHz.
  • Keywords
    Biomembranes; Coplanar transmission lines; Dielectric substrates; Hollow waveguides; Impedance; Loss measurement; Metallization; Micromachining; Silicon compounds; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2003 33rd European
  • Conference_Location
    Munich, Germany
  • Print_ISBN
    1-58053-834-7
  • Type

    conf

  • DOI
    10.1109/EUMA.2003.340821
  • Filename
    4142949