Coplanar Passive Circuits on Surface Micromachined Silicon and Thick Polymer Layers for Millimeter-wave Applications

In this paper, we report a novel technological issue for the realization of low loss coplanar passive circuits on low resistivity (LR-20 ¿.cm) silicon substrate using simultaneously a silicon surface micromachining in the slots and a thick polymer layer (BCB). The silicon etching into the coplanar slots leads indeed to a noticeable decrease of the losses, whereas filling the coplanar gaps with the low loss polymer minimizes the field interaction with the lossy silicon substrate and results in a much higher quality factor.