DocumentCode
2212485
Title
Monte Carlo simulation of thermoelectric properties in nanocomposites
Author
Jeng, Ming-Shan ; Yang, Ronggui ; Chen, Gang
Author_Institution
Dept. of Mech. Eng., MIT, Cambridge, MA, USA
fYear
2005
fDate
19-23 June 2005
Firstpage
21
Lastpage
26
Abstract
This paper presents a Monte Carlo simulation scheme to study the thermoelectric properties of nanocomposites with special attention paid to the implementation of periodic boundary condition in Monte Carlo simulation. The scheme is applied to study the thermal conductivity of silicon germanium (Si-Ge) nanocomposites, which are of great interest for high efficiency thermoelectric material development. The size effects of phonon transport in nanoparticle composites were studied and the results show that the thermal conductivity of nanoparticle composites can be lower than alloy value. It was found that randomly distributed nanoparticles in nanocomposites rendered the thermal conductivity values very close to that of nanocomposites with periodically aligned mono-size nanoparticles. This suggests that interfacial area per unit volume is a useful parameter to correlate the size effect of thermoelectric properties in nanocomposites.
Keywords
Ge-Si alloys; Monte Carlo methods; nanocomposites; nanoparticles; phonons; semiconductor materials; thermal conductivity; thermoelectricity; Monte Carlo simulation; Si-Ge; high efficiency thermoelectric material; interfacial area; nanoparticle composites; periodic boundary condition; periodically aligned monosize nanoparticles; phonon transport; randomly distributed nanoparticles; silicon germanium nanocomposites; size effects; thermal conductivity; thermoelectric properties; Boltzmann equation; Conducting materials; Mechanical engineering; Nanocomposites; Nanostructured materials; Nanostructures; Phonons; Superlattices; Thermal conductivity; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
ISSN
1094-2734
Print_ISBN
0-7803-9552-2
Type
conf
DOI
10.1109/ICT.2005.1519877
Filename
1519877
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