DocumentCode :
2212573
Title :
Building-In Reliability During Product Development in IBM Microelectronics
Author :
Rathore, H.S. ; Wactilk, R.A. ; Filippi, R. ; Gajda, J.
Author_Institution :
IBM Microelectronics Division
fYear :
1993
fDate :
24-27 Oct 1993
Firstpage :
124
Lastpage :
143
Keywords :
Electromigration; Insulation; Integrated circuit reliability; Manufacturing processes; Materials reliability; Microelectronics; Nonhomogeneous media; Product development; Qualifications; Robustness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
Type :
conf
DOI :
10.1109/IRWS.1993.666301
Filename :
666301
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2212573
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