• DocumentCode
    2212664
  • Title

    Experience using the boundary element method in electrostatic computations as a fundamental tool in high voltage switchgear design

  • Author

    Lopez-Roldan, J. ; Ozers, P. ; Judge, T. ; Rebizant, C. ; Bosch, R. ; Munoz, J.

  • Author_Institution
    Reyrolle, Rolls-Royce T&D, UK
  • Volume
    2
  • fYear
    1998
  • fDate
    7-10 Jun 1998
  • Firstpage
    685
  • Abstract
    In the last ten years we have seen fast development in the computational methods used in all fields of engineering. The possibility of getting rapid and accurate models of High Voltage (H.V.) Switchgear can reduce considerably the high cost of development testing. In this paper the Boundary Element Method (BEM) is discussed from an industrial user point of view. First we analyse the advantages of using the BEM specifically for three-dimensional electrostatic computations. Two examples are presented. One model is an epoxy rod between two coaxial electrodes in which the electrical field distribution around metal inserts, H.V. shields and along the creepage distance is required. Also shown is the calculation of the change of field configuration after a discharge between the contacts of a disconnector. In these examples, a three dimensional analysis is necessary because of the geometry of the problem. These kinds of problems are often found in H.V. engineering and were resolved in the past using much less accurate two-dimensional approximations
  • Keywords
    boundary-elements methods; electrostatics; switchgear; HV shield; boundary element method; coaxial electrode; creepage distance; discharge; disconnector contact; electrical field distribution; epoxy rod; high voltage switchgear design; metal insert; three-dimensional electrostatic computation; Boundary element methods; Coaxial components; Contacts; Costs; Electrodes; Electrostatic analysis; Geometry; Switchgear; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1998. Conference Record of the 1998 IEEE International Symposium on
  • Conference_Location
    Arlington, VA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-4927-X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1998.694885
  • Filename
    694885