• DocumentCode
    2212809
  • Title

    Evolution of Slot Partial Discharges under Electrical, Thermal and Mechanical Stresses

  • Author

    Levesque, Martin ; Hudon, C. ; Belec, M. ; David, E.

  • Author_Institution
    Ecole de Technol. Super. de Montreal, Montreal, QC
  • fYear
    2008
  • fDate
    9-12 June 2008
  • Firstpage
    153
  • Lastpage
    157
  • Abstract
    To improve the understanding of slot partial discharges (PD) activity in air-cooled generators, an accelerated aging test was conducted under different stress conditions on a total of six stator bars. The bars, which had been previously modified by the abrasion of a portion of their semi-conductive coating in order to create slot PD activity, were divided into three groups of two. The first group was electrically stressed at 16 kV AC while the second was both electrically and thermally stressed at 85degC by a circulating current. The last group was electrically and thermally stressed but, in addition, exposed to mechanical abrasion caused by lamination stacks vibrating on the bare insulation where slot PD were occurring. Partial discharge measurements were recorded at room temperature for each of the six bars separately as a function of aging time. Comparison of the change in the PD patterns reveals the differences in degradation when one stress or a combination of stresses is present.
  • Keywords
    AC generators; insulation testing; life testing; machine insulation; machine testing; partial discharge measurement; stators; thermal stresses; accelerated aging test; air-cooled generator; electrical stress; mechanical abrasion; mechanical stress; semiconductive coating; slot partial discharge measurement; stator bar; thermal stress; Accelerated aging; Coatings; Dielectrics and electrical insulation; Lamination; Partial discharge measurement; Partial discharges; Stator bars; Temperature; Testing; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2008. ISEI 2008. Conference Record of the 2008 IEEE International Symposium on
  • Conference_Location
    Vancouver, BC
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-2091-9
  • Electronic_ISBN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.2008.4570299
  • Filename
    4570299