Title :
Electrical-thermal co-analysis for power delivery networks in 3D system integration
Author :
Xie, Jianyong ; Chung, Daehyun ; Swaminathan, Madhavan ; Mcallister, Michael ; Deutsch, Alina ; Jiang, Lijun ; Rubin, Barry J.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrical resistivity of conductors is taken into account. For thermal analysis, Joule heating effect due to the current flowing through conductors is considered. The proposed co-analysis method is carried out using Rgen and ChipJoule of IBM EIP Tool Suite. An example of 3D integration system including stacked chips, power delivery network, glass-ceramic substrate, through-silicon vias, controlled collapse chip connections (C4s), underfill material, and TIM is analyzed using the proposed method. The simulation results show that the temperature effect on IR drop can not be neglected. The error of not considering thermal effect on IR drop is about 20% in the example.
Keywords :
distribution networks; electrical resistivity; power engineering computing; 3D system integration; Joule heating effect; controlled collapse chip connections; electrical-thermal co-analysis; power delivery networks; temperature-dependent electrical resistivity; Computer networks; Conducting materials; Conductors; Electric resistance; Heating; Packaging; Power engineering computing; Temperature distribution; Through-silicon vias; Voltage; 3D integration; IR drop; Joule heating; electrical-thermal co-anlysis; power delivery network (PDN); temperature effect; through-silicon via (TSV);
Conference_Titel :
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-4511-0
Electronic_ISBN :
978-1-4244-4512-7
DOI :
10.1109/3DIC.2009.5306525
