• DocumentCode
    2213087
  • Title

    Surface Degradation of Nanostructured Polypropylene Compounds Caused by Partial Discharges

  • Author

    Takala, M. ; Sallinen, T. ; Nevalainen, P. ; Pelto, J. ; Kannus, K.

  • Author_Institution
    Dept. of Electr. Energy Eng., Tampere Univ. of Technol., Tampere
  • fYear
    2008
  • fDate
    9-12 June 2008
  • Firstpage
    205
  • Lastpage
    209
  • Abstract
    This paper presents the results of the surface degradation measurements conducted on nanostructured polymer compounds consisting of polypropylene (PP), polyaniline (PANI) and acrylic acid (AA). According to prior investigations the chosen additives have improved the electrical performance of polypropylene e.g. dielectric breakdown strength and relative permittivity. Materials were subjected to high voltage stress leading to partial discharges (PD). Surface degradation was measured with optical profilometry. The partial discharge activity during corona bombardment was also measured. The measurements were conducted at the high voltage laboratory of Tampere University of Technology. Statistical analysis was applied to the results to determine the effects of the additive on the surface degradation and PD activity of polypropylene.
  • Keywords
    corona; electric breakdown; nanostructured materials; partial discharges; statistical analysis; acrylic acid; dielectric breakdown strength; nanostructured polypropylene compounds; optical profilometry; partial discharges; polyaniline; polypropylene; relative permittivity; statistical analysis; surface degradation measurements; Additives; Dielectric breakdown; Dielectric measurements; Partial discharge measurement; Partial discharges; Permittivity measurement; Polymers; Surface discharges; Thermal degradation; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2008. ISEI 2008. Conference Record of the 2008 IEEE International Symposium on
  • Conference_Location
    Vancouver, BC
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-2091-9
  • Electronic_ISBN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.2008.4570311
  • Filename
    4570311