Title :
ESD performance evaluation of powered high-speed interfaces
Author :
Koch, Sebastian ; Gossner, Harald ; Gieser, Horst ; Maurer, Linus
Author_Institution :
Intel Deutschland GmbH, Neubiberg, Germany
Abstract :
An approach towards evaluating the ESD performance of high-speed interfaces is presented. By applying ESD stress to powered USB 3.0 interfaces the propagation of very short ESD pulses is investigated. Soft failures caused by TLP stress are put into relation to hard failure thresholds of the unpowered devices as well as soft failures induced by IEC 61000-4-2 pulses.
Keywords :
Data transfer; Electrostatic discharges; IEC Standards; Magnetic fields; Probes; Stress; Universal Serial Bus; high-speed interface; soft failure; system level ESD;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2015 IEEE International Symposium on
Conference_Location :
Dresden, Germany
Print_ISBN :
978-1-4799-6615-8
DOI :
10.1109/ISEMC.2015.7256322
