DocumentCode
2213320
Title
Known Good Die Carrier Reliability Evaluation
Author
Agahdel, Fariborz ; Teoh, Hongbee ; Rlzzo, S.P. ; Roebuck, Randal D.
Author_Institution
Micromodule Systems
fYear
1993
fDate
24-27 Oct 1993
Firstpage
162
Lastpage
166
Keywords
Biomembranes; Control systems; Costs; Instruments; Materials reliability; Materials testing; Performance evaluation; Sockets; System testing; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1993 International
Type
conf
DOI
10.1109/IRWS.1993.666304
Filename
666304
Link To Document