Title :
Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking
Author :
Eid, E. ; Lacrevaz, T. ; de Rivaz, S. ; Bermond, C. ; Fléchet, B. ; Calmon, F. ; Gontrand, C. ; Farcy, A. ; Cadix, L. ; Ancey, P.
Author_Institution :
IMEP-LAHC, Univ. de Savoie, Le Bourget du Lac, France
Abstract :
In 3D integrated circuits, substrate coupling effects due to propagation of high frequency (HF) parasitic signals are carried by through silicon vias (TSV). These electrical coupling leads to several impacts on performance of 3D circuits. In this paper, predictive HF electrical simulations are achieved by full wave analysis in order to make obvious the coupling effect due to TSVs presence. Solutions to reduce substrate coupling are proposed and discussed.
Keywords :
electronic engineering computing; integrated circuit layout; 3D integrated circuits stacking; electrical coupling; high frequency parasitic signals; predictive high frequency effects; substrate coupling effects; through silicon vias; Analytical models; Circuit simulation; Coupling circuits; Frequency; Hafnium; Predictive models; Silicon; Stacking; Three-dimensional integrated circuits; Through-silicon vias;
Conference_Titel :
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-4511-0
Electronic_ISBN :
978-1-4244-4512-7
DOI :
10.1109/3DIC.2009.5306547
