Title :
SiGe/Si superlattice power generators
Author :
Zeng, Gehong ; Bowers, John E. ; Zhang, Yan ; Shakouri, Ali
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Abstract :
SiGe is one of the best thermoelectric materials for high temperature applications. Superlattice structures can further enhance the thermoelectric properties by reducing the thermal conductivity and by increasing the Seebeck coefficient via selective emission of hot electrons through thermionic emission. SiGe/Si superlattice structures were grown on a silicon wafer using molecular beam epitaxy. A single element SiGe/Si superlattice thermoelectric power generator was fabricated and characterized. The device element, a 3 μm thick SiGe/Si superlattice on a 3.95 μm SiGe buffer layer, was grown on 5 inch diameter 650 microns thick silicon substrate. Output power of 0.1 W/cm with a resistive load was measured with a temperature drop of 220°C across the generator element. There was a significant parasitic lead resistance. Simulations show that if the temperature drop is increased to 300°C, a power density of 1 W/cm can be achieved when working in impedance matching condition.
Keywords :
Ge-Si alloys; Seebeck effect; electron emission; hot carriers; impedance matching; molecular beam epitaxial growth; semiconductor growth; semiconductor materials; semiconductor superlattices; silicon; thermal conductivity; thermoelectric conversion; thermoelectric power; 3 mum; 3.95 mum; 5 inch; 650 micron; Seebeck coefficient; SiGe-Si; SiGe/Si superlattice power generators; buffer layer; generator element; impedance matching condition; molecular beam epitaxy; output power; parasitic lead resistance; power density; resistive load; selective hot electron emission; silicon wafer; thermal conductivity; thermionic emission; thermoelectric materials; Conducting materials; Electron emission; Germanium silicon alloys; Power generation; Silicon germanium; Superlattices; Temperature measurement; Thermal conductivity; Thermionic emission; Thermoelectricity;
Conference_Titel :
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
Print_ISBN :
0-7803-9552-2
DOI :
10.1109/ICT.2005.1519913