DocumentCode
2213539
Title
An Investigation of Key Factors in the Manufacturability and Qualification of Known Good Die Processes
Author
VanOverloop, Don ; Walker, Scott
Author_Institution
Motorola Inc.
fYear
1993
fDate
24-27 Oct 1993
Firstpage
167
Lastpage
175
Keywords
Assembly; Bonding; Costs; Manufacturing processes; Packaging machines; Performance evaluation; Production; Qualifications; System testing; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1993 International
Type
conf
DOI
10.1109/IRWS.1993.666305
Filename
666305
Link To Document