مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

2213721

Title :

Known-good-die Technologies

Author :

Vasquez, Barbara

Author_Institution :

Motorola

fYear :

1993

fDate :

24-27 Oct 1993

Firstpage :

179

Lastpage :

183

Keywords :

Assembly; Circuit testing; Integrated circuit packaging; Manufacturing; Marketing and sales; Multichip modules; Packaging machines; Protection; Protocols; Qualifications;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Integrated Reliability Workshop Final Report, 1993 International

Type :

conf

DOI :

10.1109/IRWS.1993.666306

Filename :

666306

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2213721