• DocumentCode
    2213735
  • Title

    ANSYS-based detailed thermo-mechanical modeling of complex thermoelectric power designs

  • Author

    Soto, Marco A. ; Venkatasubramanian, Rama

  • Author_Institution
    Res. Triangle Inst., Research Triangle Park, NC, USA
  • fYear
    2005
  • fDate
    19-23 June 2005
  • Firstpage
    219
  • Lastpage
    221
  • Abstract
    Using Finite Element Analysis (FEA) via ANSYS Workbench simulation software, complicated coupled-field analyses of thermoelectric devices can be performed. This is effective in examining the thermo-mechanical stresses introduced in these devices through their operation. Due to the large temperature gradients inherent in their operation, as well as the mismatch in coefficients of thermal expansion, large stresses can be present during power generation. This stress can lead to device failure in several ways; the device may break, bowing of the system may lead to a loss in thermal contact between layers and subsequent reduction in heat transfer. FEA simulations examined the mechanical behavior of the device at operating temperatures, including; determination of the optimum pellet length for shear stress minimization, and modeling the behavior of Niobium compliance pads in the system.
  • Keywords
    bending; failure (mechanical); finite element analysis; fracture; heat transfer; internal stresses; niobium; physics computing; thermal expansion; thermal stresses; thermoelectric conversion; thermoelectric devices; thermoelectric power; ANSYS Workbench simulation software; ANSYS-based detailed thermo-mechanical modeling; FEA; Finite Element Analysis; Nb; Niobium compliance pads; bowing; complex thermoelectric power designs; coupled-field analyses; device failure; heat transfer reduction; optimum pellet length; power generation; shear stress minimization; system breakage; thermal contact; thermal expansion coefficient; thermo-mechanical stress; thermoelectric devices; Analytical models; Finite element methods; Performance analysis; Software performance; Temperature; Thermal expansion; Thermal stresses; Thermoelectric devices; Thermoelectricity; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2005. ICT 2005. 24th International Conference on
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-9552-2
  • Type

    conf

  • DOI
    10.1109/ICT.2005.1519923
  • Filename
    1519923